Integrated dual-laser photonic chip for high-purity carrier generation enabling ultrafast terahertz wireless communicationsShow others and affiliations
2022 (English)In: Nature Communications, E-ISSN 2041-1723, Vol. 13, no 1, article id 1388Article in journal (Refereed) Published
Abstract [en]
Photonic generation of Terahertz (THz) carriers displays high potential for THz communications with a large tunable range and high modulation bandwidth. While many photonics-based THz generations have recently been demonstrated with discrete bulky components, their practical applications are significantly hindered by the large footprint and high energy consumption. Herein, we present an injection-locked heterodyne source based on generic foundry-fabricated photonic integrated circuits (PIC) attached to a uni-traveling carrier photodiode generating high-purity THz carriers. The generated THz carrier is tunable within the range of 0-1.4 THz, determined by the wavelength spacing between the two monolithically integrated distributed feedback (DFB) lasers. This scheme generates and transmits a 131 Gbits(-1) net rate signal over a 10.7-m distance with -24 dBm emitted power at 0.4 THz. This monolithic dual-DFB PIC-based THz generation approach is a significant step towards fully integrated, cost-effective, and energy-efficient THz transmitters. A photonic Terahertz source based on injection-locking an integrated dual-laser chip generates and transmits a 131 Gbps THz signal over 10.7-m distance, showing great potential towards fully integrated and energy-efficient THz transmitters for 6G.
Place, publisher, year, edition, pages
Springer Nature , 2022. Vol. 13, no 1, article id 1388
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Atom and Molecular Physics and Optics Other Physics Topics
Identifiers
URN: urn:nbn:se:kth:diva-310591DOI: 10.1038/s41467-022-29049-2ISI: 000770096400021PubMedID: 35296670Scopus ID: 2-s2.0-85126668975OAI: oai:DiVA.org:kth-310591DiVA, id: diva2:1649879
Note
QC 20220405
2022-04-052022-04-052023-03-28Bibliographically approved