Stacking of two-dimensional materials to large-area heterostructures by wafer bondingShow others and affiliations
2021 (English)In: Optics InfoBase Conference Papers, The Optical Society , 2021Conference paper, Published paper (Refereed)
Abstract [en]
The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS2).
Place, publisher, year, edition, pages
The Optical Society , 2021.
Keywords [en]
Layered semiconductors, Sulfur compounds, Wafer bonding, High volume manufacturing, Photonic application, Semiconductor equipment, Stackings, Two-dimensional materials, Molybdenum compounds
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering Theoretical Chemistry Nano Technology
Identifiers
URN: urn:nbn:se:kth:diva-313214Scopus ID: 2-s2.0-85120039724OAI: oai:DiVA.org:kth-313214DiVA, id: diva2:1665889
Conference
CLEO: Science and Innovations, CLEO:S and I 2021 - Part of Conference on Lasers and Electro-Optics, CLEO 2021, 9 May 2021 through 14 May 2021
Note
Part of proceedings: ISBN 9781557528209, QC 20230117
2022-06-082022-06-082025-03-28Bibliographically approved