Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding Show others and affiliations
2021 (English) In: 2021 Conference on Lasers and Electro-Optics, CLEO 2021 - Proceedings, Institute of Electrical and Electronics Engineers Inc. , 2021Conference paper, Published paper (Refereed)
Abstract [en]
The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS2).
Place, publisher, year, edition, pages Institute of Electrical and Electronics Engineers Inc. , 2021.
Keywords [en]
Layered semiconductors, Optical fibers, Sulfur compounds, Wafer bonding, High volume manufacturing, Photonic application, Semiconductor equipment, Stackings, Two-dimensional materials, Molybdenum compounds
National Category
Atom and Molecular Physics and Optics Other Materials Engineering
Identifiers URN: urn:nbn:se:kth:diva-313857 ISI: 000831479800049 Scopus ID: 2-s2.0-85120456618 OAI: oai:DiVA.org:kth-313857 DiVA, id: diva2:1668264
Conference 2021 Conference on Lasers and Electro-Optics, CLEO 2021, Virtual, Online, 9-14 May 2021
Note Part of proceedings: ISBN 978-1-943580-91-0
Not duplicate with DiVA 1665889
QC 20230206
2022-06-132022-06-132023-02-06 Bibliographically approved