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Silicon-Micromachined THz Radar Frontend
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems. (THz Group)ORCID iD: 0000-0001-5048-2296
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-8264-3231
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2023 (English)Conference paper, Oral presentation with published abstract (Refereed)
Abstract [en]

This paper describes a silicon micromachined radar frontend. The designed frontend system includes active and passive elements within a single silicon chip due to the high integration capability of silicon micromachining techniques. The active part includes a switching circuit, and the passive part consists of a beam steering and beam shaping network and a 2×8 array antenna. The frontend has two WR-3.4 standard waveguide ports, and each port can create two frequency steerable radiation patterns controlled by the switching circuit. The return loss of both ports is better than 10 dB at 220-267 GHz for both beam shapes. The size of the whole system is 14.3×20×1.2 mm, and it can be used in imaging, tracking, and surveillance applications.

Place, publisher, year, edition, pages
Sweden, 2023.
National Category
Engineering and Technology Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-327636OAI: oai:DiVA.org:kth-327636DiVA, id: diva2:1760796
Conference
Swedish Microwave Days 2023
Note

QC 20230612

Available from: 2023-05-31 Created: 2023-05-31 Last updated: 2023-06-12Bibliographically approved

Open Access in DiVA

fulltext(591 kB)71 downloads
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Type fulltextMimetype application/pdf

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Karimi, ArminShah, UmerOberhammer, Joachim

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CiteExportLink to record
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  • apa
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