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Sub-THz Silicon-Micromachined Reconfigurable Beam-Steering Frontend
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems. (THz Group)ORCID iD: 0000-0001-5048-2296
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0002-8264-3231
KTH, School of Electrical Engineering and Computer Science (EECS), Intelligent systems, Micro and Nanosystems.ORCID iD: 0000-0003-3339-9137
2023 (English)In: 2023 53rd European Microwave Conference, EuMC 2023, Institute of Electrical and Electronics Engineers (IEEE) , 2023Conference paper, Oral presentation with published abstract (Refereed)
Abstract [en]

This paper presents a silicon micromachined reconfigurable beam-steering frontend chip in which multiple components are integrated within a single silicon chip. The size o the whole frontend chip is 14.3×20×1.2 mm3. The signal path includes a novel switching circuit, a beam-steering network, two power-dividing networks, and a 2×8 array antenna. The presented frontend chip is able to create two frequency steerable beam-shapes. The switching circuit determines which beam shape to be radiated. The first beam-shape is a steerable broad fan-beam with reduced sidelobe level (SLL) in the H-plane, and the second is a steerable notched fan-beam. The measured SLL of the broad beam is better than 18.5 dB in the H-plane, and the measured notch depth is better than 24 dB in the E-plane pattern. Both radiation patterns can be steered by frequency and move from -20 degrees at 238 GHz to +20 degrees at 248 GHz.The measured return loss of the fabricated device is better than 15 dB at 220-265 GHz, which is equal to almost 18.6 % fractional bandwidth.

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers (IEEE) , 2023.
Keywords [en]
Antenna array, beam-steering, frontend, imaging, MEMS, radar, rectangular waveguide, silicon micromachining, THz.
National Category
Engineering and Technology Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-327639DOI: 10.23919/EuMC58039.2023.10290347ISI: 001101795000112Scopus ID: 2-s2.0-85177608243OAI: oai:DiVA.org:kth-327639DiVA, id: diva2:1760801
Conference
53rd European Microwave Conference, EuMC 2023, Berlin, Germany, 19 - 21 September 2023
Note

QC 20231204

Available from: 2023-05-31 Created: 2023-05-31 Last updated: 2024-03-18Bibliographically approved

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Karimi, ArminShah, UmerOberhammer, Joachim

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