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Relations Between Material Properties And Performance Of Paperboard Packages
RISE Research Institutes of Sweden AB, RISE Research Institutes of Sweden AB.
Billerud AB, Billerud AB.
KTH, School of Engineering Sciences (SCI), Engineering Mechanics, Vehicle Engineering and Solid Mechanics, Solid Mechanics.ORCID iD: 0000-0001-8699-7910
2023 (English)In: TAPPICon 2023: "Rock the Roll: Unleashing the Harmonies of the Paper Industry", TAPPI Press , 2023Conference paper, Published paper (Refereed)
Abstract [en]

With material properties as a starting point, this study focuses on analyzing the performance of a paperboard package. Torsional and compressive loading of a paperboard package have been investigated through physical experiments and finite element (FE) simulations, where an orthotropic linear elastic material model with a stress-based failure criterion was used. Comparing physical experiments and FE simulations of box compression and torsion showed that the finite element models could accurately predict the response curves. Additionally, the model was utilized to investigate which impact variations in moisture, bending stiffness, and crease quality had on packaging performance. The effect of moisture was examined through an established master curve, where the necessary mechanical properties could be expressed as linear functions of moisture ratio. The impact of creases was evaluated by varying previously established ratios (relative crease strength, RCS, tensile strength, RTS) for reducing the creases’ mechanical properties in the simulations. Furthermore, the results showed that the strength of the paperboard affects the maximum compressive strength and maximum torque. Still, the bending stiffness of the paperboard only had a minor effect on box compression strength. To conclude, the model accurately predicted how moisture, crease quality, and bending stiffness affected packaging performance.

Place, publisher, year, edition, pages
TAPPI Press , 2023.
National Category
Paper, Pulp and Fiber Technology Applied Mechanics
Identifiers
URN: urn:nbn:se:kth:diva-339680Scopus ID: 2-s2.0-85175864105OAI: oai:DiVA.org:kth-339680DiVA, id: diva2:1812481
Conference
TAPPICon 2023 - Rock the Roll: Unleashing the Harmonies of the Paper Industry, Cleveland, United States of America, Apr 28 2023 - May 1 2023
Note

QC 20231116

Available from: 2023-11-16 Created: 2023-11-16 Last updated: 2023-11-16Bibliographically approved

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Östlund, Sören

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CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf