Design and Fabrication of A 4-Terminal In-Plane Nanoelectromechanical RelayShow others and affiliations
2023 (English)In: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, Institute of Electrical and Electronics Engineers Inc. , 2023, p. 824-826Conference paper, Published paper (Refereed)
Abstract [en]
We present 4-terminal (4-T) silicon (Si) nanoelectron-mechanical (NEM) relays fabricated on silicon-on-insulator (SOI) wafers. We demonstrate true 4-T switching behavior with isolated control and signal paths. A pull-in voltage (Vpi ) as low as 11.6 V is achieved with the miniaturized design. 4-T NEM relays are a very promising candidate for building ultra-low-power logic circuits, since they enable novel circuit architectures to realize logic functions with far fewer devices than CMOS implementations, while also allowing the dynamic power consumption to be reduced by body-biasing.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2023. p. 824-826
Keywords [en]
4-T NEM relays, decoupled signals, in-plane Si relays, low pull-in voltage, ultra-low power consumption
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-347128Scopus ID: 2-s2.0-85193495209OAI: oai:DiVA.org:kth-347128DiVA, id: diva2:1864377
Conference
22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023, Kyoto, Japan, Jun 25 2023 - Jun 29 2023
Note
QC 20240612
Part of ISBN 978-488686435-2
2024-06-032024-06-032024-06-12Bibliographically approved