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Temperature study of deformation twinning behaviour in nickel-base Superalloy 625
Linköping Univ, Div Engn Mat, Linköping, Sweden.;Alleima AB, Sandviken, Sweden..
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Properties. Chongqing Univ, Coll Mat Sci & Engn, Chongqing, Peoples R China..
Alleima AB, Sandviken, Sweden..
Alleima AB, Sandviken, Sweden..
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2024 (English)In: Materials Science & Engineering: A, ISSN 0921-5093, E-ISSN 1873-4936, Vol. 907, article id 146628Article in journal (Refereed) Published
Abstract [en]

Deformation behaviour in the Nickel-base superalloy 625 has been studied by tensile testing at four temperatures: 295, 223, 173 and 77 K. The microstructure has been investigated using TEM, FIB-SEM, EBSD and ECCI techniques. Deformation in the alloy turns out to be a competitive course of events between at least two deformation mechanisms, namely dislocation slip and deformation twinning. Slip is the predominant deformation mechanism at higher temperatures. While at 77 K, deformation induced twinning gives an extra degree of freedom as one of the main deformation mechanisms, i.e., the material shows a twin induced plasticity, TWIP, behaviour. Ab initio calculations indicate that the influence of cryogenic/sub-zero temperatures on the stacking fault energy of this alloy can be limited and therefore the formation of deformation twins cannot be determined solely by the stacking fault energy. The results implies that critical strain and strain hardening rate influences the deformation twinning onset and twinning rate.

Place, publisher, year, edition, pages
Elsevier BV , 2024. Vol. 907, article id 146628
Keywords [en]
Ni-base alloy, Superalloy, Deformation induced twinning, Density function theory, Stacking fault energy
National Category
Metallurgy and Metallic Materials
Identifiers
URN: urn:nbn:se:kth:diva-349759DOI: 10.1016/j.msea.2024.146628ISI: 001249470600001Scopus ID: 2-s2.0-85189025767OAI: oai:DiVA.org:kth-349759DiVA, id: diva2:1881407
Note

QC 20240703

Available from: 2024-07-03 Created: 2024-07-03 Last updated: 2024-07-03Bibliographically approved

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Dong, ZhihuaVitos, Levente

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