3-D Printed Haptic Devices for Educational ApplicationsShow others and affiliations
2016 (English)In: IEEE HAPTICS SYMPOSIUM 2016 / [ed] Choi, SM Kuchenbecker, KJ Gerling, G, IEEE , 2016, p. 126-133Conference paper, Published paper (Refereed)
Abstract [en]
Haptic technology has the potential to expand and transform the ways that students can experience a variety of science, technology, engineering, and math (STEM) topics. Designing kinesthetic haptic devices for educational applications is challenging because of the competing objectives of using low-cost components, making the device robust enough to be handled by students, and the desire to render high fidelity haptic virtual environments. In this paper, we present the evolution of a device called " Hapkit": a low cost, one-degree-of-freedom haptic kit that can be assembled by students. From 2013-2015, different versions of Hapkit were used in courses as a tool to teach haptics, physics, and control. These include a Massive Open Online Course (MOOC), two undergraduate courses, a graduate course, and a middle school class. Based on our experience using Hapkit in these educational environments, we evolved the design in terms of its structural materials, drive mechanism, and mechatronic components. Our latest design, Hapkit 3.0, includes several features that allow students to manufacture and assemble a robust and high-fidelity haptic device. First, it uses 3-D printed plastic structural material, which allows the design to be built and customized using readily available tools. Second, the design takes into account the limitations of 3-D printing, such as warping during printing and poor tolerances. This is achieved at a materials cost of approximately US $ 50, which makes it feasible for distribution in classroom and online education settings. The open source design is available at http://hapkit. stanford. edu.
Place, publisher, year, edition, pages
IEEE , 2016. p. 126-133
Series
IEEE Haptics Symposium, ISSN 2324-7347
National Category
Other Engineering and Technologies
Identifiers
URN: urn:nbn:se:kth:diva-355215DOI: 10.1109/HAPTICS.2016.7463166ISI: 000383011400020Scopus ID: 2-s2.0-84967153593ISBN: 978-1-5090-0903-9 (print)OAI: oai:DiVA.org:kth-355215DiVA, id: diva2:1907896
Conference
24th IEEE Haptics Symposium, APR 08-11, 2016, Philadelphia, PA
Note
QC 20241024
2024-10-242024-10-242025-02-10Bibliographically approved