Design and wafer-level fabrication of SMA wire microactuators on silicon
2010 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 19, no 4, 982-991 p.Article in journal (Refereed) Published
This paper reports on the fabrication of microactuators through wafer-level integration of prestrained shape memory alloy wires to silicon structures. In contrast to previous work, the wires are strained under pure tension, and the cold-state reset is provided by single-crystalline silicon cantilevers. The fabrication is based on standard microelectromechanical systems manufacturing technologies, and it enables an actuation scheme featuring high work densities. A mathematical model is discussed, which provides a useful approximation for practical designs and allows analyzing the actuators performance. Prototypes have been tested, and the influence of constructive variations on the actuator behavior is theoretically and experimentally evaluated. The test results are in close agreement with the calculated values, and they show that the actuators feature displacements that are among the highest reported.
Place, publisher, year, edition, pages
IEEE Press, 2010. Vol. 19, no 4, 982-991 p.
Actuator, adhesive bonding, bias spring, cantilever, microelectromechanical systems (MEMS), NiTi, reset mechanism, shape memory alloy (SMA), silicon structure, SU-8, TiNi, wafer-level integration
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-11829DOI: 10.1109/JMEMS.2010.2049474ISI: 000283543400029ScopusID: 2-s2.0-77955414734OAI: oai:DiVA.org:kth-11829DiVA: diva2:284098
QC 20100729 Uppdaterad från accepted till published (20110217)2010-01-042010-01-042015-06-18Bibliographically approved