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MEMS single-chip 5x5 and 20x20 double-switch arrays for telecommunication networks
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
2007 (English)In: IEEE 20th International Conference on Micro Electro Mechanical Systems, 2007. MEMS, New York: IEEE , 2007, 811-814 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports on a microelectromechanical switch array with up to 20x20 double switches and packaged on a single chip and utilized for main distribution frames in copper-wire networks. The device includes 5x5 or 20x20 allowing for an any-to-any interconnection of the input line to the specific output line. The switches are on an electrostatic S-shaped film actuator with the contact moving between a top and a bottom electrode. device is fabricated in two parts and is designed to assembled using selective adhesive wafer bonding in a wafer-scale package of the switch array. The 5x5 switch arrays have a size of 6.7x6.4mm(2) and the arrays are 14x10 mm(2) large. The switch actuation for closing/opening the switches averaged over an array measured to be 21.2 V / 15.3 V for the 5x5 array 93.2 V / 37.3 V for the 20x20 array. The total impedance varies on the 5x5 array between 0.126 Omega 0.564 Omega at a measurement current of 1 mA. The resistance of the switch contacts within the 5x5 array determined to be 0.216 Omega with a standard deviation 0. 155 Omega.

Place, publisher, year, edition, pages
New York: IEEE , 2007. 811-814 p.
Series
Proceedings: IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
Keyword [en]
Composite micromechanics, Copper, Electrostatic actuators, Mechanical engineering, Mechanics, Mechatronics, MEMS, Microelectromechanical devices, Optical design, Reactive ion etching, Switching circuits, Telecommunication networks, Telecommunication systems, Wafer bonding
National Category
Information Science
Identifiers
URN: urn:nbn:se:kth:diva-13780DOI: 10.1109/MEMSYS.2007.4433176ISI: 000255867800217Scopus ID: 2-s2.0-50049130020ISBN: 978-142440951-8 ISBN: 1424409519 (print)OAI: oai:DiVA.org:kth-13780DiVA: diva2:327249
Conference
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) Kobe, Japan, January 21-25, 2007
Note

QC 20141208

Available from: 2010-06-28 Created: 2010-06-28 Last updated: 2014-12-08Bibliographically approved

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Stemme, Göran

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