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Adhesive wafer bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
2006 (English)In: Journal of Applied Physics, ISSN 0021-8979, E-ISSN 1089-7550, Vol. 99, no 3Article, review/survey (Refereed) Published
Abstract [en]

Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.

Place, publisher, year, edition, pages
2006. Vol. 99, no 3
Keyword [en]
coupled microring resonators, v optoelectronic devices, thin-film transistors, rf mems switch, hybrid integration, silicon micromirrors, microfluidic systems, 3d integration, layer transfer, fabrication
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-15424DOI: 10.1063/1.2168512ISI: 000235341000001Scopus ID: 2-s2.0-33645536175OAI: oai:DiVA.org:kth-15424DiVA: diva2:333465
Note
QC 20100525, QC 20111102Available from: 2010-08-05 Created: 2010-08-05 Last updated: 2017-12-12Bibliographically approved

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Niklaus, FrankStemme, Göran

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