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Metal printing ECPR of copper interconnects down to 500 nm using - Electrochemical pattern replication
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2006 (English)In: Microelectronic Engineering, ISSN 0167-9317, E-ISSN 1873-5568, Vol. 83, no 09-apr, 1410-1413 p.Article in journal (Refereed) Published
Abstract [en]

Printing of copper patterns with dimensions from 100 mu m down to 500 nm lines and 280 run space was demonstrated using electrochemical pattern replication with a master electrode (template) having a pattern depth of 2500 nm. SEM measurements were done to measure the mean line width as well as CD variations on the master and the replicated copper lines. It was found that accurate replication of 500 nm thick metal patterns was enabled by the process and that CD variations in the master were dominating compared to the variations introduced by the electrochemical pattern transfer itself.

Place, publisher, year, edition, pages
2006. Vol. 83, no 09-apr, 1410-1413 p.
Keyword [en]
ECPR, metal printing, copper interconnects, imprinting, electroplating, lithography, imprint
National Category
Nano Technology
Identifiers
URN: urn:nbn:se:kth:diva-15676DOI: 10.1016/j.mee.2006.01.208ISI: 000237581900191Scopus ID: 2-s2.0-33646493695OAI: oai:DiVA.org:kth-15676DiVA: diva2:333718
Note
QC 20100525 QC 20111004. Conference: 31st International Conference on Micro- and Nano-Engineering. Vienna, AUSTRIA. SEP 19-22, 2005.Available from: 2010-08-05 Created: 2010-08-05 Last updated: 2017-12-12Bibliographically approved

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