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Comparative study of thermally grown oxides on n-type free standing 3C-SiC (001)
KTH, School of Information and Communication Technology (ICT), Microelectronics and Applied Physics, MAP.ORCID iD: 0000-0001-8108-2631
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2009 (English)In: Journal of Applied Physics, ISSN 0021-8979, E-ISSN 1089-7550, Vol. 106, no 4Article in journal (Refereed) Published
Abstract [en]

Alternative ways to improve the oxidation process of free standing 3C-SiC (001) are developed and tested with the aim to reduce the fixed and mobile charges in the oxide and at the SiO2/3C-SiC interface. The postoxidation annealing step in wet oxygen (O-2+H-2) is demonstrated to be beneficial for n-type 3C-SiC metal-oxide-semi conductor capacitors resulting in significant reduction in flat band voltage shift, effective oxide charge density, and density of interface traps. The inefficiency of nitridation for the improvement of the oxide quality on 3C-SiC is discussed.

Place, publisher, year, edition, pages
2009. Vol. 106, no 4
Keyword [en]
sic/sio2 interface states, nitridation, capacitors, oxidation, traps
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-18784DOI: 10.1063/1.3204642ISI: 000270083800111Scopus ID: 2-s2.0-69749102705OAI: oai:DiVA.org:kth-18784DiVA: diva2:336831
Note
QC 20100525Available from: 2010-08-05 Created: 2010-08-05 Last updated: 2017-12-12Bibliographically approved
In thesis
1. Fabrication and Characterization of 3C- and4H-SiC MOSFETs
Open this publication in new window or tab >>Fabrication and Characterization of 3C- and4H-SiC MOSFETs
2011 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

During the last decades, a global effort has been started towards the implementation of energy efficient electronics. Silicon carbide (SiC), a wide band-gap semiconductor is one of the potential candidates to replace the widespread silicon (Si) which enabled and dominates today’s world of electronics. It has been demonstrated that devices based on SiC lead to a drastic reduction of energy losses in electronic systems. This will help to limit the global energy consumption and the introduction of renewable energy generation systems to a competitive price.

Active research has been dedicated to SiC since the 1980’s. As a result, a mature SiC growth technology has been developed and 4 inch SiC wafers are today commercially available. Research and development activities on the fabrication of SiC devices have also been carried out and resulted in the commercialization of SiC devices. In 2011, Schottky barrier diodes, bipolar junction transistors, and junction field effect transistors can be purchased from several electronic component manufacturers.

However, the device mostly used in electronics, the metal-oxide-semiconductor field effect transistor (MOSFET) is only recently commercially available in SiC. This delay is due to critical technology issues related to reliability and stability of the device, which still challenge many researchers all over the world.

This thesis summarizes the main challenges of the SiC MOSFET fabrication process. State of the art technology modules like the gate stack formation, the drain/source ohmic contact formation, and the passivation layer deposition are considered and contributions of this work to the development of these technology modules is reported.

The investigated technology modules are integrated into the complete fabrication process of vertical MOSFET devices. This MOSFET process was tested using cubic SiC (3C-SiC) and hexagonal SiC (4H-SiC) wafers and achieved results will be discussed.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2011. xviii, 97 p.
Series
Trita-ICT/MAP AVH, ISSN 1653-7610 ; 2011:05
Keyword
SiC, MOSFETs, Fabrication, Characterization
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - ICT
Identifiers
urn:nbn:se:kth:diva-32367 (URN)978-91-7415-913-4 (ISBN)
Public defence
2011-05-06, Sal C1, KTH-Electrum, Isafjordsgatan 22, Kista, 11:38 (English)
Opponent
Supervisors
Funder
EU, FP7, Seventh Framework Programme, MRTN-CT-2006-035735
Note
QC 20110415Available from: 2011-04-15 Created: 2011-04-13 Last updated: 2011-04-29Bibliographically approved

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Zetterling, Carl-Mikael

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