Room-Temperature Sealing of Microcavities by Cold Metal Welding
2009 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 18, no 6, 1318-1325 p.Article in journal (Refereed) Published
In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of micro-cavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.
Place, publisher, year, edition, pages
2009. Vol. 18, no 6, 1318-1325 p.
Bonding, fabrication, microelectromechanical devices, packaging, wafer, vacuum, solder
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-19009DOI: 10.1109/jmems.2009.2030956ISI: 000272318900017ScopusID: 2-s2.0-71549130435OAI: oai:DiVA.org:kth-19009DiVA: diva2:337056
QC 201005252010-08-052010-08-052010-12-17Bibliographically approved