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Formation of wide and deep pores in silicon by electrochemical etching
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.ORCID iD: 0000-0002-5260-5322
2000 (English)In: Materials Science & Engineering: B. Solid-state Materials for Advanced Technology, ISSN 0921-5107, Vol. 69, 29-33 p.Article in journal (Refereed) Published
Abstract [en]

Electrochemical etching of n-type silicon in hydrofluoric acid electrolyte is now well known as a technique for micro- or macroporous silicon formation. It is commonly admitted that the width of pores can extend over four orders of magnitude, from 2 nm to 20 mu m. In this study the feasibility of using this technique to form larger pores is demonstrated. The use of a water-ethanol solvent mixture (1:1) is shown to modify the electrochemistry of silicon dissolution and pore formation. The formation of stable wide pores requires adjustment of the etching current during the pore formation as a function of the evolution of the current-voltage curve with etching time. An array of 42-mu m wide pores with 2-mu m wall thickness and 200-mu m depth were etched using this method. The feasibility to etch pores up to 100 mu m in width is also presented. The results enable to conclude that the electrochemical etching of n-type silicon could be used to form vertical structures, without restrictions concerning the wall spacing. This provides a useful tool for micro-machining.

Place, publisher, year, edition, pages
2000. Vol. 69, 29-33 p.
Keyword [en]
electrochemical etching, pore formation, micro-machining, n-type silicon, porous silicon, physics
URN: urn:nbn:se:kth:diva-19590ISI: 000085591900005OAI: diva2:338282
QC 20100525Available from: 2010-08-10 Created: 2010-08-10Bibliographically approved

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Linnros, Jan
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