Single level integration packaging: Meeting the requirements of ultra high density and high frequency
2000 (English)In: Journal of electronics manufacturing, ISSN 0960-3131, Vol. 10, no 1, 59-67 p.Article in journal (Refereed) Published
The traditional electronic packaging hierarchies present ct bottleneck for increasing system speed and density. A revolutionary rethinking is therefore necessary which aims to integrate or eliminate the current packaging hierarchies towards single level hierarchy integration. In this paper, such a novel packaging scenario is introduced. Its technology concerns and electric performance are studied.
Place, publisher, year, edition, pages
2000. Vol. 10, no 1, 59-67 p.
IdentifiersURN: urn:nbn:se:kth:diva-20434ISI: 000167437000004OAI: oai:DiVA.org:kth-20434DiVA: diva2:339129
QC 201005252010-08-102010-08-10Bibliographically approved