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Pad de-embedding in RF CMOS
2001 (English)In: IEEE Circuits & Devices, ISSN 8755-3996, E-ISSN 1558-1888, Vol. 17, no 3, 8-11 p.Article in journal (Refereed) Published
Abstract [en]

Welcome to The Chip! We remain committed to bringing you material you can use in your work and research. We solicit your contributions and input on what we present here. Material or short articles on chip design tips, modeling and characterization techniques, yield enhancement, packaging, and test are welcome, as well as news on new chips and start-ups, mergers, acquisitions, partnerships in the microchip business, etc. Please continue to e-mail us at ismail@ee.eng.ohio-state.edu or ntan@globespan.net. In this column, we discuss techniques for RF pad layout and de-embedding, a topic of great interest particularly for implementing radio frequency (RF) circuits in mainstream CMOS technology. Happy reading!

Place, publisher, year, edition, pages
2001. Vol. 17, no 3, 8-11 p.
Identifiers
URN: urn:nbn:se:kth:diva-20730ISI: 000169452800003OAI: oai:DiVA.org:kth-20730DiVA: diva2:339427
Note
QC 20100525Available from: 2010-08-10 Created: 2010-08-10 Last updated: 2017-12-12Bibliographically approved

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