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Single level integrated packaging modules for high performance electronic systems
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
2001 (English)In: IEEE Transactions on Advanced Packaging, ISSN 1521-3323, E-ISSN 1557-9980, Vol. 24, no 4, 477-485 p.Article in journal (Refereed) Published
Abstract [en]

In this paper, we studied a novel packaging scenario that aims to integrate or eliminate the existing multilevel packaging hierarchies toward single level integration. This new approach is an extension of VLSI technology where standard IC processes were pursued in the whole fabrication sequence. Main benefits include very high performance, ultra high density, mixed-signal integration, and inexpensive. Several key technologies such as chip assembly and planarization were developed. A feasible fabrication procedure for single level integration has been established. Demonstrating modules were presented. Interconnect structures, signal and power distribution, and electrical performance were studied theoretically and experimentally for GHz off-chip operating. Properties of signal propagation and coupling from chip to chip were investigated both in frequency domain and in time domain by simulations and by high frequency measurements. The studies show that the new modules are capable of several Gb/s/pin data rate for off-chip communications. Besides, some design guidelines for best performance are obtained through the work.

Place, publisher, year, edition, pages
2001. Vol. 24, no 4, 477-485 p.
Keyword [en]
chip and system packaging, high performance system, mixed-signal systems, multichip modules, power distribution, signal propagation and crosstalk, single level integration packaging, system-in-package, on-chip interconnections
URN: urn:nbn:se:kth:diva-21314ISI: 000173843000011OAI: diva2:340012
QC 20100525Available from: 2010-08-10 Created: 2010-08-10Bibliographically approved

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