Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Chemical vapor deposition of silicon in a lamp-heated reactor - Effects of heat absorption, emission, and conduction
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.ORCID iD: 0000-0002-5845-3032
2002 (English)In: Journal of the Electrochemical Society, ISSN 0013-4651, E-ISSN 1945-7111, Vol. 149, no 6, C355-C361 p.Article in journal (Refereed) Published
Abstract [en]

Deposition of polycrystalline Si (poly-Si) on oxidized Si and silicon-on-sapphire (SOS) substrates in an ASM Epsilon-2000 reactor with a SiC-coated graphite susceptor is studied. A simple model for the poly-Si growth rate, taking into account effects of wafer emissivity and absorptivity on instantaneous wafer temperature, is used to assist assessment of the depositions. The success of poly-Si deposition on SOS in the lamp-heated single-wafer reactor with a SiC-coated graphite susceptor confirms that the substrate wafer is mainly heated by thermal conduction from the underlying susceptor. However, the poor ability for the SOS wafers to absorb radiative energies from the heating lamps results in a 6-12% reduction of growth rates of poly-Si, as compared to identical depositions on Si substrates. Hence, thermal radiation from the lamps as well as from the susceptor contributes to detail regulations of the wafer temperature. Calculation of wafer emissivity and absorptivity and measurement of susceptor temperature indicate that in response to variations in the wafer absorptivity during deposition, the lamp radiation is regulated. Since the wafer emissivity varies simultaneously during deposition, the true wafer temperature can deviate from the set-point temperature measured at the thermocouple encapsulated in the susceptor under the wafer. Our modeling of growth rates for poly-Si deposition on oxidized Si substrates qualitatively agrees with the experimentally measured data.

Place, publisher, year, edition, pages
2002. Vol. 149, no 6, C355-C361 p.
Keyword [en]
wafers
Identifiers
URN: urn:nbn:se:kth:diva-21540DOI: 10.1149/1.1475689ISI: 000175564700041OAI: oai:DiVA.org:kth-21540DiVA: diva2:340238
Note
QC 20100525Available from: 2010-08-10 Created: 2010-08-10 Last updated: 2017-12-12Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full text

Search in DiVA

By author/editor
Zhang, Shi-LiRadamson, Henry H.Östling, Mikael
By organisation
Microelectronics and Information Technology, IMIT
In the same journal
Journal of the Electrochemical Society

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 28 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf