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Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0001-9552-4234
2003 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 12, no 3, 296-301 p.Article in journal (Refereed) Published
Abstract [en]

We present the first hollow out-of-wafer-plane silicon microneedles having openings in the shaft rather than having an orifice at the tip. These structures are well suited for transdermal microfluidic applications, e.g., drug or vaccine delivery. The developed deep-reactive ion etching (DRIE) process allows fabrication of two dimensional, mechanically highly resistant needle arrays offering low resistance to liquid flows and a large exposure area between the fluid and the tissue. The presented process does not require much wafer handling and only two photolithography steps are required. Using a 3 x 3 mm(2) chip in a typical application, e.g., vaccine delivery, a 100 mul volume of aqueous fluid injected in 2 s would cause a pressure drop of less than 2 kPa. The presented needles are approximately 210 mum long.

Place, publisher, year, edition, pages
2003. Vol. 12, no 3, 296-301 p.
Keyword [en]
deep-reactive ion etching (DRIE), delivery, drug, microneedle, transdermal, vaccine
Identifiers
URN: urn:nbn:se:kth:diva-22564DOI: 10.1109/jmems.2003.809959ISI: 000183356300009OAI: oai:DiVA.org:kth-22564DiVA: diva2:341262
Note
QC 20100525Available from: 2010-08-10 Created: 2010-08-10 Last updated: 2017-12-12Bibliographically approved

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Stemme, Göran

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