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System-on-package: a broad perspective from system design to technology development
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
2003 (English)In: Microelectronics and reliability, ISSN 0026-2714, E-ISSN 1872-941X, Vol. 43, no 8, 1339-1348 p.Article in journal (Refereed) Published
Abstract [en]

In this paper, we summarize and analyze main challenges towards system-on-package (SoP) integration with a broad perspective from system design to technology development. We see that the future SoP faces a main challenge of changed system architecture that will be different from today's personal computer or PC-based systems. It is likely that communication-network based system architectures will be interesting to future SoP platforms. Second, we find that a major paradigm shift will occur in design methodology for SoP integration that emphasizes a coherent co-design of chip, package and system in a mixed signal environment and in combination with new issues such as virtual components integration. On the technology side, the major challenges will be power dissipation and system cooling, low-cost and thermal-matched high-density interconnect substrates, as well as low-cost passive components integration. Finally, we present some research examples that aim to cope with these new challenges on a strategic basis.

Place, publisher, year, edition, pages
2003. Vol. 43, no 8, 1339-1348 p.
Keyword [en]
performance, chip, integration
Identifiers
URN: urn:nbn:se:kth:diva-22740DOI: 10.1016/s0026-2714(03)00182-3ISI: 000184674500024OAI: oai:DiVA.org:kth-22740DiVA: diva2:341438
Note
QC 20100525Available from: 2010-08-10 Created: 2010-08-10 Last updated: 2017-12-12Bibliographically approved

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