Wafer-Scale Manufacturing of Robust Trimorph Bulk SMA Microactuators
2008 (English)In: ACTUATOR 08, CONFERENCE PROCEEDINGS / [ed] Borgmann H., 2008, 382-385 p.Conference paper (Refereed)
This paper demonstrates the concept of wafer-level fabrication and integration of robust bulk SMA microactuators based on selective adhesive bonding of cold-rolled SMA sheets to silicon wafers. Contact printing of an adhesive polymer ensures a selective bonding when transferring full SMA sheets to silicon structures on a patterned wafer. The induced stress of a thin dielectric film deposited on top of the SMA sheet ensures a stable and built-in reset mechanism of the actuators. The trimorph microactuators can be actuated by indirect resistive heating using electrical current through a thin metal film. We report on the successful wafer-scale fabrication of actuator cantilevers and their characteristics. First test cantilevers show a cold-state deflection of 300 mu m which, however, is limited by the silicon substrate. Upon heating, the cantilever shows a stroke of approx. 80 mu m.
Place, publisher, year, edition, pages
2008. 382-385 p.
SMA, microactuators, wafer-level integration, adhesive bonding
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24315ISI: 000270938400080OAI: oai:DiVA.org:kth-24315DiVA: diva2:346515
11th International Conference on New Actuators/5th International Exhibition on Smart Actuators and Drive Systems Bremen, GERMANY, JUN 09-11, 2008
QC 201102032010-09-012010-09-012011-02-03Bibliographically approved