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Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
2010 (English)In: MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, IEEE , 2010, 480-483 p.Conference paper, Published paper (Refereed)
Abstract [en]

The three-dimensional (3D) integration of electronics and/or MEMS-based transducers is an emerging technology that vertically interconnects stacked dies using through silicon vias (TSVs). They enable the realization of devices with shorter signal lengths, smaller packages and lower parasitic capacitances, which can result in higher performance and lower costs. This paper presents a novel low-cost fabrication technique for metal-filled TSVs using bonded gold-wires as conductive path. In this concept the wires are surrounded by polymer, which acts both as an electrical insulator causing low capacitive coupling towards the substrate and as a buffer for thermo-mechanical stress.

Place, publisher, year, edition, pages
IEEE , 2010. 480-483 p.
Series
Proceedings: Ieee Micro Electro Mechanical Systems, ISSN 1084-6999
Keyword [en]
Bonding, Cable insulation, Costs, Electronics packaging, Fabrication, Parasitic capacitance, Polymers, Silicon, Transducers, Wires
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24312DOI: 10.1109/MEMSYS.2010.5442460ISI: 000278416400118Scopus ID: 2-s2.0-77952772699ISBN: 978-1-4244-5764-9 (print)OAI: oai:DiVA.org:kth-24312DiVA: diva2:350040
Conference
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Hong Kong, PEOPLES R CHINA, JAN 24-28, 2010
Note
© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.QC 20110203Available from: 2011-11-10 Created: 2010-09-01 Last updated: 2011-11-10Bibliographically approved

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Fischer, Andreas C.Stemme, GöranNiklaus, Frank

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