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Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.), Solid Mechanics (Div.).
2010 (English)Report (Other academic)
Abstract [en]

Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonous and cyclic loading at different strain rates. With regards to the observed complex material behavior, the non-linear mixed hardening Armstrong and Fredrick model combined with the Perzyna viscoplastic law was chosen to fit the experimental data. This model was subsequently implemented into a commercial finite element code and used to simulate drop tests. Actual drop test experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested.

Place, publisher, year, edition, pages
Stockholm: KTH , 2010. , 22 p.
Trita-HFL, ISSN 1104-6813 ; 487
URN: urn:nbn:se:kth:diva-24650OAI: diva2:352484
QC 20100921Available from: 2010-09-21 Created: 2010-09-21 Last updated: 2010-09-21Bibliographically approved
In thesis
1. On mechanical modeling of composite materials
Open this publication in new window or tab >>On mechanical modeling of composite materials
2010 (English)Doctoral thesis, comprehensive summary (Other academic)
Place, publisher, year, edition, pages
Stockholm: KTH, 2010. 19 p.
Trita-HFL. Report / Royal Institute of Technology, Solid mechanics, ISSN 1654-1472 ; 0494
urn:nbn:se:kth:diva-24644 (URN)
Public defence
2010-10-01, Sal E3, Osquars backe 14, KTH, Stockholm, 10:00 (English)

QC 20100921

Available from: 2010-09-21 Created: 2010-09-20 Last updated: 2013-01-14Bibliographically approved

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Bonnaud, Etienne L.
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Solid Mechanics (Div.)

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