On indentation and scratching of thin films on hard substrates
2008 (English)In: Journal of Physics D: Applied Physics, ISSN 0022-3727, E-ISSN 1361-6463, Vol. 41, no 7, 074022- p.Article in journal (Refereed) Published
Indentation and scratching of thin film/substrate structures, using sharp conical indenters, are studied theoretically and numerically and discussed in particular with material characterization in mind. For simplicity, but not out of necessity, the material behaviour is described by classical elastoplasticity accounting for large deformations. Explicit material parameters are chosen in order to arrive at representative results as regards material behaviour and indenter geometry. The main efforts are devoted towards an understanding of the influence from the film/substrate boundary on global indentation (scratching) properties at different material combinations. Global quantities to be investigated include indentation and scratching hardness, contact area and apparent coefficient of friction at scratching. A comparison of the mechanical behaviour at normal indentation and at scratching is also included. In addition, the behaviour of different field variables is studied and in this case the discussion is focused on fracture initiation governed by a critical stress criterion. The numerical investigation is performed using the finite element method and the numerical strategy is discussed in some detail. Throughout the analysis it is assumed that the substrate is considerably harder than the indented film and consequently the deformation of the substrate is neglected.
Place, publisher, year, edition, pages
2008. Vol. 41, no 7, 074022- p.
Elastoplasticity, Finite element method, Geometry, Indentation, Numerical methods, Substrates, Global indentation, Hard substrates, Scratching hardness
IdentifiersURN: urn:nbn:se:kth:diva-24680DOI: 10.1088/0022-3727/41/7/074022ISI: 000254173700023ScopusID: 2-s2.0-41149123222OAI: oai:DiVA.org:kth-24680DiVA: diva2:352682
QC 201009222010-09-222010-09-222010-09-22Bibliographically approved