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LARGE SCALE INTEGRATED 3D MICROFLUIDIC NETWORKS THROUGH HIGH YIELD FABRICATION OF VERTICAL VIAS IN PDMS
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0441-6893
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
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2010 (English)In: MEMS 2010: 23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2010), IEEE conference proceedings, 2010, 240-243 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper introduces a robust, high yield, single-step fabrication method for creating densely spaced, miniaturized out-of-plane fluidic interconnecting channels (=vias) in standard poly(dimethylsiloxane) PDMS. Unblocked vias are essential for creating 3D microfluidic networks. Previously reported methods either had low yield, because of residual membranes covering the vias after polymerization, or required complicated extra steps to remove the blocking membranes.

In contrast, our method prevents the formation of residual membranes by inhibition of the polymerization on top of the protuding mold features defining the vias locations. In addition to providing unblocked vias, the inhibition also leaves a flat partially cured, sticky top surface that adheres well to other surfaces and allows self-sealing stacking of several PDMS layers. We demonstrate the new method by manufacturing a densely perforated PDMS membrane and a large scale integrated (LSI) 3D PDMS microfluidic channel network. Our method enables batch manufacturing of complex fluidic devices by speeding up and simplifying the fabrication of complex microfluidic components in standard PDMS.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2010. 240-243 p.
Series
IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24725DOI: 10.1109/MEMSYS.2010.5442520ISI: 000278416400058Scopus ID: 2-s2.0-77952781881ISBN: 978-1-4244-5764-9 (print)OAI: oai:DiVA.org:kth-24725DiVA: diva2:353148
Conference
23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2010),Wanchai, Hong Kong, China, 24-28 Jan, 2010
Note

QC 20110204

Available from: 2010-09-24 Created: 2010-09-24 Last updated: 2015-05-18Bibliographically approved

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Haraldsson, Klas TommyStemme, Göranvan der Wijngaart, Wouter

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Carlborg, Carl FredrikHaraldsson, Klas TommyCornaglia, MatteoStemme, Göranvan der Wijngaart, Wouter
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