Novel, side opened out-of-plane microneedles for microfluidic transdermal interfacing
2002 (English)In: FIFTEENTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS,: TECHNICAL DIGEST, New York: IEEE , 2002, 467-470 p.Conference paper (Refereed)
We present the first hollow out of wafer plane silicon microneedles that have openings in the shaft rather than having an orifice at the tip. These structures are suited for transdermal microfluidic applications, e.g. drug- or vaccine delivery. The developed deep reactive ion etching (DRIE) process allows fabrication of two dimensional, mechanically highly resistant needle arrays offering low resistance to liquid flows and offering a large exposure area between the fluid and the tissue. The presented process does not require much wafer handling and only two photolithography steps are needed. Using this chip in a typical application, e.g. vaccine delivery, a 100 mul volume of aqueous fluid injected through a chip of 30 mm(2) in 2s would cause a pressure drop of less than 2kPa. The presented needles are approximately 2 10 pm long.
Place, publisher, year, edition, pages
New York: IEEE , 2002. 467-470 p.
, PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS WORKSHOP, ISSN 1084-6999
Engineering, Electrical & Electronic, Mechanical Robotics, Mechanical Optics
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24806ISI: 000174908700114ISBN: 0-7803-7185-2OAI: oai:DiVA.org:kth-24806DiVA: diva2:353577
15th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2002) LAS VEGAS, NV, JAN 20-24, 2002
QC 201009282010-09-282010-09-272010-09-28Bibliographically approved