Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding: IEEE The sixteenth annual international conference on Micro Electro Mechanical Systems
2003 (English)In: MEMS-03: IEEE THE SIXTEENTH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, New York: IEEE , 2003, 271-274 p.Conference paper (Refereed)
In this paper, we present CMOS compatible fabrication of monocrystalline silicon micromirror arrays using membrane transfer bonding. To fabricate the micromirrors, a thin monocrystalline silicon device layer is transferred from a standard silicon-on-insulator (SOI) wafer to a target wafer (e.g. a CMOS wafer) using low temperature adhesive wafer bonding. In this way, very flat, uniform and low stress micromirror membranes made of monocrystalline silicon can be directly fabricated on top of CMOS circuits. The mirror fabrication does not contain any bond alignment between the wafers; thus, the mirror dimensions and alignment accuracies are only limited by the photolithographic steps. Micromirror arrays with 4x4 pixels and a pitch size of 16mum x 16mum have been fabricated.
Place, publisher, year, edition, pages
New York: IEEE , 2003. 271-274 p.
, PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS WORKSHOP, ISSN 1084-6999
Engineering, Electrical & Electronic
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24799ISI: 000182405500067ISBN: 0-7803-7744-3OAI: oai:DiVA.org:kth-24799DiVA: diva2:354842
IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems; Kyoto; 19 January 2003 through 23 January 2003
QC 20101005 NR 201408042010-10-052010-09-272012-03-20Bibliographically approved