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Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding: IEEE The sixteenth annual international conference on Micro Electro Mechanical Systems
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0002-9327-2544
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0002-0525-8647
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0001-9552-4234
2003 (English)In: MEMS-03: IEEE THE SIXTEENTH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, New York: IEEE , 2003, 271-274 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present CMOS compatible fabrication of monocrystalline silicon micromirror arrays using membrane transfer bonding. To fabricate the micromirrors, a thin monocrystalline silicon device layer is transferred from a standard silicon-on-insulator (SOI) wafer to a target wafer (e.g. a CMOS wafer) using low temperature adhesive wafer bonding. In this way, very flat, uniform and low stress micromirror membranes made of monocrystalline silicon can be directly fabricated on top of CMOS circuits. The mirror fabrication does not contain any bond alignment between the wafers; thus, the mirror dimensions and alignment accuracies are only limited by the photolithographic steps. Micromirror arrays with 4x4 pixels and a pitch size of 16mum x 16mum have been fabricated.

Place, publisher, year, edition, pages
New York: IEEE , 2003. 271-274 p.
Series
PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS WORKSHOP, ISSN 1084-6999
Keyword [en]
Engineering, Electrical & Electronic
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24799ISI: 000182405500067ISBN: 0-7803-7744-3 (print)OAI: oai:DiVA.org:kth-24799DiVA: diva2:354842
Conference
IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems; Kyoto; 19 January 2003 through 23 January 2003
Note
QC 20101005 NR 20140804Available from: 2010-10-05 Created: 2010-09-27 Last updated: 2012-03-20Bibliographically approved

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Haasl, SjoerdNiklaus, FrankStemme, Göran

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