On-chip versus off-chip passives in radio and mixed-signal system-on-package design
2006 (English)In: ESTC 2006 - 1st Electronics Systemintegration Technology Conference, New York: IEEE , 2006, 221-232 p.Conference paper (Refereed)
Optimal total solution for new radio architecture and implementation requires accurate trade-offs for off-chip versus off-chip passives. In this paper, a complete and systematic design methodology for RF blocks in SoP (system-on-package) versus SoC (system-on-chip) is presented. This methodology explores trade-offs between Performance and cost when different on-chip or off-chip passives are used. For a better presentation, the method and design techniques are demonstrated through four multi-band/multi-standard radio design examples with various technologies and different circuit topologies. Our study reveals that, in order to obtain cost benefits in RF-SoPs, small RF chips should be merged as larger chips and the integration density of each RF chip should be high enough. Our study also indicates that in a complex chip like a multi-band radio, moving passives off chip could achieve further cost savings and significant performance improvements. These are general conclusions but, our method offers a detailed analysis which can give quantitative measurements of cost savings and performance improvements in off-chip versus off-chip passives in RF SoP design.
Place, publisher, year, edition, pages
New York: IEEE , 2006. 221-232 p.
Bandwidth, Cost effectiveness, Integrated circuit layout, Passive networks, Radio communication
Condensed Matter Physics
IdentifiersURN: urn:nbn:se:kth:diva-25002DOI: 10.1109/ESTC.2006.280002ISI: 000241425800033ScopusID: 2-s2.0-42549084691ISBN: 1-4244-0552-1ISBN: 978-142440552-7OAI: oai:DiVA.org:kth-25002DiVA: diva2:354930
ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006
QC 201010052010-10-052010-10-052014-11-26Bibliographically approved