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Characterization of transfer bonded silicon bolometer arrays
KTH, Superseded Departments, Signals, Sensors and Systems.ORCID iD: 0000-0002-0525-8647
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
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2004 (English)In: INFRARED TECHNOLOGY AND APPLICATIONS XXX, BELLINGHAM: SPIE-INT SOC OPTICAL ENGINEERING , 2004, Vol. 5406, 521-530 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper we present the design, fabrication and characterization of arrays of boron doped polycryslalline silicon bolometers, The bolometer arrays have been fabricated using CMOS compatible wafer-level transfer bonding. The transfer bonding technique allows the bolometer materials to be deposited and optimized on a separate substrate and then, in a subsequent integration step to be transferred to the read-out integrated circuit (ROIC) wafer. Transfer bonding allows thermal infrared detectors with crystalline and/or high temperature deposited, high performance temperature sensing materials to be integrated on CMOS based ROICs. Uncooled infrared bolometer arrays with 18x18 pixels and with 320x240 pixels have been fabricated on silicon substrates. Individual pixels of the arrays can be addressed for characterization purposes. The resistance of the bolometers has been measured to be in the 50 kOmega range and the temperature coefficient of resistance (TCR) of the bolometer has been measured to be -0.52 %/K. The pixel structure is designed as a resonant absorbing cavity, with expected absorbance above 90%, in the wavelength interval of 8 to 12 mum. The measured results are in good agreement with the predicted absorbance values.

Place, publisher, year, edition, pages
BELLINGHAM: SPIE-INT SOC OPTICAL ENGINEERING , 2004. Vol. 5406, 521-530 p.
Series
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, ISSN 0277-786X ; 5406
Keyword [en]
uncooled FPA, transfer bonding, CMOS compatible, polycrystalline silicon bolometer
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24792DOI: 10.1117/12.565894ISI: 000224150900058Scopus ID: 2-s2.0-10044228537ISBN: 0-8194-5329-3 (print)OAI: oai:DiVA.org:kth-24792DiVA: diva2:354933
Conference
Conference on Infrared Technology and Applications XXX Orlando, FL, APR 12-16, 2004
Note
QC 20101005Available from: 2010-10-05 Created: 2010-09-27 Last updated: 2011-11-01Bibliographically approved

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Niklaus, FrankHellström, Per-ErikStemme, Göran

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