Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology
2003 (English)In: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, 51-54 p.Conference paper (Refereed)
In this paper, we present a receiver front-end for 5 GHz wireless LAN in novel LCP (liquid crystal polymer) based system-on-package module. The module is based on embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. Furthermore, the novel LCP material shows excellent RF and microwave performance. The quality factors of key passive components such as inductors integrated in LCP substrate with thin film technologies is as high as 60. The insertion loss of the bandpass filter is 3dB. The conversion gain of the receiver front-end is 20 dB and occupies 8.7mm by 3.6mm area.
Place, publisher, year, edition, pages
2003. 51-54 p.
Condensed Matter Physics
IdentifiersURN: urn:nbn:se:kth:diva-25004DOI: 10.1109/EPEP.2003.1249998ISI: 000186891200012ISBN: 0-7803-8128-9OAI: oai:DiVA.org:kth-25004DiVA: diva2:354947
12th Topical Meeting on Electrical Performance of Electronic Packaging WESTIN PRINCETON, PRINCETON, NJ, OCT 27-29, 2003
Tidigare titel: Design and Implement of a Receiver Front-End in LCP Based System-on-Package Module with Embedded Chip Technology.
QC 201010052010-10-052010-10-052010-10-05Bibliographically approved