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Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
KTH, Superseded Departments, Electronic Systems Design.
KTH, Superseded Departments, Electronic Systems Design.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Electronic Systems Design.
2004 (English)In: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, NEW YORK: IEEE , 2004, 75-78 p.Conference paper, Published paper (Refereed)
Abstract [en]

Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. As well, influence of lossy packaging parasitics on LNA is also analyzed.

Place, publisher, year, edition, pages
NEW YORK: IEEE , 2004. 75-78 p.
National Category
Condensed Matter Physics
Identifiers
URN: urn:nbn:se:kth:diva-25010ISI: 000225765800018Scopus ID: 2-s2.0-15944383087ISBN: 0-7803-8667-1 (print)OAI: oai:DiVA.org:kth-25010DiVA: diva2:354967
Conference
13th Topical Meeting on Electrical Performance of Electronic Packaging Portland, OR, OCT 25-27, 2004
Note
QC 20101005Available from: 2010-10-05 Created: 2010-10-05 Last updated: 2012-02-14Bibliographically approved
In thesis
1. System-on-package solutions for multi-band RF front end
Open this publication in new window or tab >>System-on-package solutions for multi-band RF front end
2005 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization.

The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained.

Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.

Place, publisher, year, edition, pages
Stockholm: KTH, 2005. ix, 88 p.
Series
Trita-IMIT. LECS, ISSN 1651-4076 ; 2005:08
Keyword
chip-package co-design, multi-band radio, system-on-package
National Category
Condensed Matter Physics
Identifiers
urn:nbn:se:kth:diva-482 (URN)91-7178-187-0 (ISBN)
Public defence
2005-11-25, Sal D, KTH-Forum, 10:00
Opponent
Supervisors
Note
QC 20101005Available from: 2005-11-09 Created: 2005-11-09 Last updated: 2010-10-05Bibliographically approved

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