Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
2004 (English)In: ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, NEW YORK: IEEE , 2004, 75-78 p.Conference paper (Refereed)
Advances of VLSI and packaging technologies enable condensed integration of an RF system in a single module, known as SoC and SoP. In order to find a better solution between SoC and SoP for RF systems and their sub-systems, it is needed to predict and estimate performance of each solution. In this paper, analytical equations for noise figure and gain of inductively degenerated common-emitter low-noise amplifiers in SoP/SoC are deduced as functions of passives and packaging parasitics. They hence enable designers to evaluate overall performance of each solution quantitatively. As well, influence of lossy packaging parasitics on LNA is also analyzed.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2004. 75-78 p.
Condensed Matter Physics
IdentifiersURN: urn:nbn:se:kth:diva-25010ISI: 000225765800018ScopusID: 2-s2.0-15944383087ISBN: 0-7803-8667-1OAI: oai:DiVA.org:kth-25010DiVA: diva2:354967
13th Topical Meeting on Electrical Performance of Electronic Packaging Portland, OR, OCT 25-27, 2004
QC 201010052010-10-052010-10-052012-02-14Bibliographically approved