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RF robustness enhancement through statistical analysis of chip-package co-design
KTH, Superseded Departments, Electronic Systems Design.
KTH, Superseded Departments, Electronic Systems Design.
KTH, Superseded Departments, Electronic Systems Design.
2004 (English)In: 2004 IEEE International Symposium on Cirquits and Systems - Proceedings, IEEE , 2004, 988-991 p.Conference paper, Published paper (Refereed)
Abstract [en]

In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs in SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.

Place, publisher, year, edition, pages
IEEE , 2004. 988-991 p.
Series
Proceedings - IEEE International Symposium on Circuits and Systems, ISSN 0271-4310
Keyword [en]
chip scale packaging, integrated circuit yield, multichip modules
National Category
Condensed Matter Physics
Identifiers
URN: urn:nbn:se:kth:diva-25013DOI: 10.1109/ISCAS.2004.1328363ISI: 000223122300248Scopus ID: 2-s2.0-4344638218ISBN: 0-7803-8251-X (print)OAI: oai:DiVA.org:kth-25013DiVA: diva2:354975
Conference
IEEE International Symposium on Circuits and Systems Vancouver, Canada, May 23-26, 2004
Note

QC 20101005

Available from: 2010-10-05 Created: 2010-10-05 Last updated: 2014-12-09Bibliographically approved
In thesis
1. System-on-package solutions for multi-band RF front end
Open this publication in new window or tab >>System-on-package solutions for multi-band RF front end
2005 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

Advances in microelectronics technology have enabled us to integrate a complex electronic system (such as a radio) on a single chip or in a single package module, known as system-on-chip (SoC) and system-on-package (SoP) paradigms. This brings not only new opportunities for system integration, but also challenges in design and implementation. One of these challenges is how to achieve an optimum total solution of system integration via chip and package co-design, because there is no tool or design methodology available for such kind of optimization. This thesis focuses on innovative multi-band multi-standard radio front-end design and explores a new design methodology. The motivation of developing this design methodology is to achieve an optimum total solution for radio system implementation via chip and package co-design and co-optimization.

The methodology starts from RF packaging and components modeling. Necessary models for both on-chip and off-chip passives are developed. Parasitic effects of packages for radio chips are modeled for particular frequencies. Compared with high-speed digital packaging, RF packaging normally deals with narrow band signals. It is possible to absorb some unwanted parasitics by designing proper port matching networks. In addition, cost-performance trade-offs are performed. In this context, we first developed process and technology based cost models, which include parameters like chip real estate, raw materials, package, test and rework. Impact of process variation on final yield has also been considered in the models by using a statistical analysis approach. Performance of different design options is measured by a special FoM (figure-of-merit). Each type of analog/RF circuit (such as LNA, PA and ADC) has its own dedicated FoM. Through a series of cost-performance trade-offs for different on-chip versus off-chip passives and partitions, an optimum total solution is obtained.

Finally, this methodology was demonstrated via a number of design examples for multi-band multi-standard radio front-end. The author has explored the optimum solutions for different circuit architectures and process technologies encompassing parallel, concurrent and digitally programmable multi-band radio frond-end blocks. It is interesting to find that, for complex RF circuits like a multi-band multi-standard radio, moving some passives off-chip will have significant cost-savings. In addition to the above contributions, the author has also developed an MCM-D technology on LCP and glass substrates, based on metal deposition and BCB spin-coating at KTH clean room. The author has also performed some preliminary studies on UWB radio for RFID applications.

Place, publisher, year, edition, pages
Stockholm: KTH, 2005. ix, 88 p.
Series
Trita-IMIT. LECS, ISSN 1651-4076 ; 2005:08
Keyword
chip-package co-design, multi-band radio, system-on-package
National Category
Condensed Matter Physics
Identifiers
urn:nbn:se:kth:diva-482 (URN)91-7178-187-0 (ISBN)
Public defence
2005-11-25, Sal D, KTH-Forum, 10:00
Opponent
Supervisors
Note
QC 20101005Available from: 2005-11-09 Created: 2005-11-09 Last updated: 2010-10-05Bibliographically approved

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