RF robustness enhancement through statistical analysis of chip-package co-design
2004 (English)In: 2004 IEEE International Symposium on Cirquits and Systems - Proceedings, IEEE , 2004, 988-991 p.Conference paper (Refereed)
In order to enhance robustness of RF circuits, a flow of statistical analysis for chip-package co-design of RF system-on-package (SoP) is presented in this work. Methods for improving the yield of RF modules are developed. On-chip passive components versus off-chip passive components trade-offs in SoP module were also analyzed in terms of performance and yield. The design methods were demonstrated through case studies of LNA (low noise amplifier) in SoP.
Place, publisher, year, edition, pages
IEEE , 2004. 988-991 p.
, Proceedings - IEEE International Symposium on Circuits and Systems, ISSN 0271-4310
chip scale packaging, integrated circuit yield, multichip modules
Condensed Matter Physics
IdentifiersURN: urn:nbn:se:kth:diva-25013DOI: 10.1109/ISCAS.2004.1328363ISI: 000223122300248ScopusID: 2-s2.0-4344638218ISBN: 0-7803-8251-XOAI: oai:DiVA.org:kth-25013DiVA: diva2:354975
IEEE International Symposium on Circuits and Systems Vancouver, Canada, May 23-26, 2004
QC 201010052010-10-052010-10-052014-12-09Bibliographically approved