Robust trimorph bulk SMA microactuators for batch manufacturing and integration
2007 (English)In: The 14th IEEE International conference on Solid-State Sensors, Actuators and Microsystems Conference & EUROSENSORS XXI (IEEE TRANSDUCERS 2007), IEEE conference proceedings, 2007, 2191-2194 p.Conference paper (Refereed)
This paper introduces the concept of batch micrufabrication and electrical contacting of bulk SMA nticroactuators. This concept addresses technical solutions for the main challenges related to using SMA actuators such as the necessary mechanical bias force, the difficult electrical contacting and the high power needed for actuation. We report on initial SMA-dielectric-metal trimorph test structures and their characteristics. The bias force is provided by a dielectric layer and the electrical contacting of the bulk SMA is avoided using indirect electrical heating via an additional metal layer. Three nun long beams can provide several hundreds of mu N and deflect several hundreds of mu m. The actuation power is reduced approx. 2.5 times compared to direct heating schemes.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2007. 2191-2194 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24764DOI: 10.1109/SENSOR.2007.4300602ISI: 000249603700545ScopusID: 2-s2.0-50049119613ISBN: 978-1-4244-0841-2OAI: oai:DiVA.org:kth-24764DiVA: diva2:356079
The 14th IEEE International conference on Solid-State Sensors, Actuators and Microsystems Conference & EUROSENSORS XXI (IEEE TRANSDUCERS 2007)
QC 201010112010-10-112010-09-272015-05-20Bibliographically approved