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Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
2007 (English)In: PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2007, 754-757 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper we present for the first time a wafer-to-wafer attachment and sealing method for wafer level manufacturing of micro-cavities using a room temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs and their impact on the resulting bonds. Experiments are performed to evaluate the sealing properties against liquids and vapors of the different sealing ring structures.

Place, publisher, year, edition, pages
2007. 754-757 p.
Series
PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
Keyword [en]
Engineering, Electrical & Electronic, Nanoscience & Nanotechnology
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24749ISI: 000255867800189Scopus ID: 2-s2.0-52149092524ISBN: 978-1-4244-0950-1 (print)OAI: oai:DiVA.org:kth-24749DiVA: diva2:356756
Conference
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) Kobe, JAPAN, JAN 21-25, 2007
Note
QC 20101013Available from: 2010-10-13 Created: 2010-09-27 Last updated: 2011-11-22Bibliographically approved

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Niklaus, FrankStemme, Göran

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CiteExportLink to record
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Citation style
  • apa
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  • ieee
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  • de-DE
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Output format
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