Novel room-temperature wafer-to-wafer attachment and sealing of cavities using cold metal welding
2007 (English)In: PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, 2007, 754-757 p.Conference paper (Refereed)
In this paper we present for the first time a wafer-to-wafer attachment and sealing method for wafer level manufacturing of micro-cavities using a room temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs and their impact on the resulting bonds. Experiments are performed to evaluate the sealing properties against liquids and vapors of the different sealing ring structures.
Place, publisher, year, edition, pages
2007. 754-757 p.
, PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
Engineering, Electrical & Electronic, Nanoscience & Nanotechnology
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24749ISI: 000255867800189ScopusID: 2-s2.0-52149092524ISBN: 978-1-4244-0950-1OAI: oai:DiVA.org:kth-24749DiVA: diva2:356756
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007) Kobe, JAPAN, JAN 21-25, 2007
QC 201010132010-10-132010-09-272011-11-22Bibliographically approved