Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures
2010 (English)In: MEMS 2010: (MEMS), 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems, IEEE , 2010, 472-475 p.Conference paper (Refereed)
This paper presents a novel technique to selectively deposit nickel by electroless plating on gold seed layers using an oxygen-plasma-activation step. No prior wet surface pre- treatments or metal oxide etches are required. This enables the manufacturing of low-resistance vias for heterogeneous three-dimensional (3D) integration of MEMS but it is also a suitable technique for the fabrication of arbitrary shaped nickel-microstructures using chemically stable and cost-effective electroless nickel plating baths.
Place, publisher, year, edition, pages
IEEE , 2010. 472-475 p.
, PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
contact resistance, electroless deposition, micromechanical devices, nickel, plasma deposited coatings
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24738DOI: 10.1109/MEMSYS.2010.5442462ISI: 000278416400116ScopusID: 2-s2.0-77952750384ISBN: 978-1-4244-5761-8OAI: oai:DiVA.org:kth-24738DiVA: diva2:356823
23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010)
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