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Thermosetting nano-imprint resists: Novel materials for adhesive wafer bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
2007 (English)In: PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, New York: IEEE , 2007, 390-393 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper we present for the first time the use of the thermosetting nano-imprint resist series mr-I 9000 as adhesive wafer bonding material suitable for heterogeneous three-dimensional (3D) integration of MEMS with integrated circuits. Detailed adhesive bonding process parameters for the thermosetting nano-imprint resist are presented with which void-free and uniform bonding interfaces can be achieved. Experiments have been performed to optimize the thickness uniformity of the nano-imprint resist layer in the bonded wafer stack. The use of nano-imprint resists as adhesive material for wafer-to-wafer bonding are specifically suitable for applications in which the adhesive layer is used as a temporary or sacrificial bonding material.

Place, publisher, year, edition, pages
New York: IEEE , 2007. 390-393 p.
Series
PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
Keyword [en]
adhesive bonding, micromechanical devices, nanostructured materials, resists, wafer bonding
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-24748DOI: 10.1109/MEMSYS.2007.4433057ISI: 000255867800098Scopus ID: 2-s2.0-52249118322ISBN: 978-1-4244-095-5 (print)OAI: oai:DiVA.org:kth-24748DiVA: diva2:356846
Conference
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007)
Note
QC 20101014Available from: 2010-10-14 Created: 2010-09-27 Last updated: 2011-11-22Bibliographically approved

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Niklaus, FrankStemme, Göran

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