Thermosetting nano-imprint resists: Novel materials for adhesive wafer bonding
2007 (English)In: PROCEEDINGS OF THE IEEE TWENTIETH ANNUAL INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, New York: IEEE , 2007, 390-393 p.Conference paper (Refereed)
In this paper we present for the first time the use of the thermosetting nano-imprint resist series mr-I 9000 as adhesive wafer bonding material suitable for heterogeneous three-dimensional (3D) integration of MEMS with integrated circuits. Detailed adhesive bonding process parameters for the thermosetting nano-imprint resist are presented with which void-free and uniform bonding interfaces can be achieved. Experiments have been performed to optimize the thickness uniformity of the nano-imprint resist layer in the bonded wafer stack. The use of nano-imprint resists as adhesive material for wafer-to-wafer bonding are specifically suitable for applications in which the adhesive layer is used as a temporary or sacrificial bonding material.
Place, publisher, year, edition, pages
New York: IEEE , 2007. 390-393 p.
, PROCEEDINGS: IEEE MICRO ELECTRO MECHANICAL SYSTEMS, ISSN 1084-6999
adhesive bonding, micromechanical devices, nanostructured materials, resists, wafer bonding
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-24748DOI: 10.1109/MEMSYS.2007.4433057ISI: 000255867800098ScopusID: 2-s2.0-52249118322ISBN: 978-1-4244-095-5OAI: oai:DiVA.org:kth-24748DiVA: diva2:356846
20th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2007)
QC 201010142010-10-142010-09-272011-11-22Bibliographically approved