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Microactuation utilizing wafer-level integrated SMA wires
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.
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2009 (English)In: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems, 2009, no MEMS, 1067-1070 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper reports on the wafer-scale integration of pre-strained SMA wires to microstructured silicon devices and the performance of the microactuator prototypes. The overall goal is to obtain low cost microactuators having high work densities and a mass production compatible manufacturing, without having to deal with the inherently high costs of a pick-and-place approach or with the complex composition control and annealing process of sputtered NiTi films. Testing above the SMA transformation temperature shows repeatability in actuation of the fabricated structures, with net strokes of 170 ptm for the double cantilever actuators.

Place, publisher, year, edition, pages
2009. no MEMS, 1067-1070 p.
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-25364DOI: 10.1109/MEMSYS.2009.4805571Scopus ID: 2-s2.0-65949090302ISBN: 978-1-4244-2978-3 (print)ISBN: 978-1-4244-2977-6 (print)OAI: oai:DiVA.org:kth-25364DiVA: diva2:358034
Conference
IEEE 22nd International Conference on Micro Electro Mechanical Systems
Note
QC 20101020Available from: 2010-10-20 Created: 2010-10-19 Last updated: 2010-10-20Bibliographically approved

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Stemme, Göranvan der Wijngaart, Wouter

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Gradin, HenrikBraun, StefanStemme, Göranvan der Wijngaart, Wouter
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