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Room-temperature wafer-level hermetic sealing for liquid reservoirs by gold ring embossing
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
2009 (English)In: TRANSDUCERS 2009: 15th International Conference on Solid-State Sensors, 2009, Vol. Actuators and Microsystems, 833-836 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this paper, we present a novel room temperature wafer-level sealing process for hermetic sealing of reservoirs filled with liquids. This technique can be used for e.g. drug delivery devices or thermo pneumatic devices. The sealing mechanism is based on plastic deformation of metal squeeze rings and embossing of target structures. Epoxy based underfill is used for mechanical stabilization of the wafer bond. We present experimental results from room-temperature bonding of glass wafers to silicon wafers with encapsulation of liquids in reservoirs.

Place, publisher, year, edition, pages
2009. Vol. Actuators and Microsystems, 833-836 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-25359DOI: 10.1109/SENSOR.2009.5285763Scopus ID: 2-s2.0-71449086861ISBN: 978-1-4244-4193-8 (E) (print)ISBN: 978-1-4244-4190-7 (print)OAI: oai:DiVA.org:kth-25359DiVA: diva2:358567
Conference
15th International Conference on Solid-State Sensors
Note
QC 20101022Available from: 2010-10-22 Created: 2010-10-19 Last updated: 2011-11-22Bibliographically approved

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Niklaus, FrankStemme, Göran

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