FULL WAFER INTEGRATION OF SHAPE MEMORY ALLOY MICROACTUATORS USING ADHESIVE BONDING
2009 (English)In: 15th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2009), IEEE conference proceedings, 2009, 845-848 p.Conference paper (Refereed)
This paper presents the wafer-scale manufacturing of microactuators based on bulk shape memory alloy material integrated using adhesive bonding. The work addresses key technical challenges related to the wafer-scale fabrication of bulk SMA micro actuators, including wafer-scale integration of patterned SMA sheets to structured Si wafers and the integration of cold state reset layers to the microactuators. Contact printing of an adhesive polymer ensures a selective bonding when transferring full SMA sheets to silicon structures on a patterned wafer. The stressed films deposited on top of the SMA microactuator ensure a built-in reset mechanism of the actuators. The paper reports on the successful wafer-scale integration of wafer-sized SMA sheets and the wafer-scale fabrication of actuator cantilevers. First test cantilevers with a length of 2.5 mm show a stroke of approx. 180 ï¿œm.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2009. 845-848 p.
MEMS, Microelectromechanical systems, SMA, Titanium-Nickel, adhesive bonding, microactuator, shape memory alloy, wafer-scale integration
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-25360DOI: 10.1109/SENSOR.2009.5285794ScopusID: 2-s2.0-71449125315ISBN: 978-1-4244-4193-8OAI: oai:DiVA.org:kth-25360DiVA: diva2:358575
15th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2009), Denver, CO, 21-25 Jun, 2009
QC 201010222010-10-222010-10-192015-06-03Bibliographically approved