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SELECTIVE ELECTROCHEMICAL RELEASE ETCHING OF EUTECTICALLY BONDED MICROSTRUCTURES
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
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2009 (English)In: 15th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2009): 15th International Conference on Solid-State Sensors, IEEE conference proceedings, 2009, 743-746 p.Conference paper, Published paper (Refereed)
Abstract [en]

TThis paper reports on the successful demonstration of a novel microfabrication method in which eutectic gold bonded microstructures are selectively electrochemically release etched. This method offers several advantages: both a strong permanent bond and a temporary bond is achieved on the same die, the footprint of the temporary bonded structures is allowed to be larger than the footprint of the permanently bonded structures and the used etchants provide a larger process compatibility than the etchants of other release etch methods. Eutectically bonded 350 mum wide silicon structures were fully released after 1 hour of electrochemical etching followed by 1.5 hours wet etching of the TiW adhesion layer.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2009. 743-746 p.
Keyword [en]
Wafer bonding, electrochemical etching, eutectic bonding, release etching, selective etching
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-25357DOI: 10.1109/SENSOR.2009.5285586Scopus ID: 2-s2.0-71449100989ISBN: 978-1-4244-4193-8 (print)Archive number: 978-1-4244-4193-8OAI: oai:DiVA.org:kth-25357DiVA: diva2:358577
Conference
15th IEEE International Conference on Solid-State Sensors, Actuators and Microsystems (IEEE TRANSDUCERS 2009), Denver,CO, 21-25 Jun, 2009
Note

QC 20101022

Available from: 2010-10-22 Created: 2010-10-19 Last updated: 2015-06-03Bibliographically approved

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fulltext(1544 kB)47 downloads
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Stemme, Göranvan der Wijngaart, Wouter

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Gradin, HenrikBraun, StefanSterner, MikaelStemme, Göranvan der Wijngaart, Wouter
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Microsystem Technology (Changed name 20121201)
Electrical Engineering, Electronic Engineering, Information Engineering

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