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Wafer counter-bonding for integrating CTE-mismatched substrates and its application to MEMS tuneable metamaterials
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology.
2009 (English)In: TRANSDUCERS 2009: 15th International Conference on Solid-State Sensors, 2009, Vol. Actuators and Microsystems, 1722-1725 p.Conference paper, Published paper (Refereed)
Abstract [en]

This paper presents symmetrical counter-bonding as a method for integrating multiple substrates of non-compatible thermo-mechanical properties. This technique is successfully applied to fabricate MEMS tuneable high-impedance surfaces combining four substrates of two otherwise fabrication-incompatible materials (silicon and AF45 glass) on a wafer-level. A large-scale high-impedance surface with 200 x 52 array elements with a pitch of 350 ï¿œm and a total size of 70 x 18mm2 has been fabricated and the microwave properties of the devices have successfully been characterized at 70-114GHz. Furthermore, micron-sized surface waviness in the glass substrates, induced by the thermal cycling under mechanical stress in the bonding process, has been investigated during temperature cycling.

Place, publisher, year, edition, pages
2009. Vol. Actuators and Microsystems, 1722-1725 p.
Keyword [en]
metamaterials, micromechanical devices, silicon, thermal stresses, wafer bonding
Identifiers
URN: urn:nbn:se:kth:diva-25358DOI: 10.1109/SENSOR.2009.5285734Scopus ID: 2-s2.0-71449084785ISBN: 978-1-4244-4193-8 (print)OAI: oai:DiVA.org:kth-25358DiVA: diva2:358578
Conference
Solid-State Sensors, Actuators and Microsystems Conference, 2009, Denver
Note
QC 20101022Available from: 2010-10-22 Created: 2010-10-19 Last updated: 2010-10-22Bibliographically approved

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Stemme, Göran

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