Wafer counter-bonding for integrating CTE-mismatched substrates and its application to MEMS tuneable metamaterials
2009 (English)In: TRANSDUCERS 2009: 15th International Conference on Solid-State Sensors, 2009, Vol. Actuators and Microsystems, 1722-1725 p.Conference paper (Refereed)
This paper presents symmetrical counter-bonding as a method for integrating multiple substrates of non-compatible thermo-mechanical properties. This technique is successfully applied to fabricate MEMS tuneable high-impedance surfaces combining four substrates of two otherwise fabrication-incompatible materials (silicon and AF45 glass) on a wafer-level. A large-scale high-impedance surface with 200 x 52 array elements with a pitch of 350 ï¿œm and a total size of 70 x 18mm2 has been fabricated and the microwave properties of the devices have successfully been characterized at 70-114GHz. Furthermore, micron-sized surface waviness in the glass substrates, induced by the thermal cycling under mechanical stress in the bonding process, has been investigated during temperature cycling.
Place, publisher, year, edition, pages
2009. Vol. Actuators and Microsystems, 1722-1725 p.
metamaterials, micromechanical devices, silicon, thermal stresses, wafer bonding
IdentifiersURN: urn:nbn:se:kth:diva-25358DOI: 10.1109/SENSOR.2009.5285734ScopusID: 2-s2.0-71449084785ISBN: 978-1-4244-4193-8OAI: oai:DiVA.org:kth-25358DiVA: diva2:358578
Solid-State Sensors, Actuators and Microsystems Conference, 2009, Denver
QC 201010222010-10-222010-10-192010-10-22Bibliographically approved