Mechanical properties of liquid-phase-bonded copper-ceramic substrates.
1982 (English)In: Journal of The American Ceramic Society, ISSN 0002-7820, E-ISSN 1551-2916, Vol. 65, no 3, 149-153 p.Article in journal (Refereed) Published
Liquid-phase bonding of copper foils to ceramic substrates is a very attractive technique for the fabrication of metallized substrates for hybrid power electronics applications. The design and reliability considerations of such substrates necessitate the knowledge of their mechanical properties. Therefore, stresses and strains in the copper and in the ceramic of bonded substrates were investigated. Theoretical calculations are presented to support the experimental results.
Place, publisher, year, edition, pages
1982. Vol. 65, no 3, 149-153 p.
CERAMIC MATERIALS - Bonding, PRINTED CIRCUITS
Materials Engineering Mechanical Engineering
IdentifiersURN: urn:nbn:se:kth:diva-25470DOI: 10.1111/j.1151-2916.1982.tb10384.xISI: A1982NG58700005OAI: oai:DiVA.org:kth-25470DiVA: diva2:358718
QC 201010252010-10-252010-10-252010-10-25Bibliographically approved