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Mechanical properties of liquid-phase-bonded copper-ceramic substrates.
Brown Boveri Research Centre.
Brown Boveri Research Centre.
Brown Boveri Research Centre.ORCID iD: 0000-0002-0307-8917
1982 (English)In: Journal of The American Ceramic Society, ISSN 0002-7820, E-ISSN 1551-2916, Vol. 65, no 3, 149-153 p.Article in journal (Refereed) Published
Abstract [en]

Liquid-phase bonding of copper foils to ceramic substrates is a very attractive technique for the fabrication of metallized substrates for hybrid power electronics applications. The design and reliability considerations of such substrates necessitate the knowledge of their mechanical properties. Therefore, stresses and strains in the copper and in the ceramic of bonded substrates were investigated. Theoretical calculations are presented to support the experimental results.

Place, publisher, year, edition, pages
1982. Vol. 65, no 3, 149-153 p.
Keyword [en]
CERAMIC MATERIALS - Bonding, PRINTED CIRCUITS
National Category
Materials Engineering Mechanical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-25470DOI: 10.1111/j.1151-2916.1982.tb10384.xISI: A1982NG58700005OAI: oai:DiVA.org:kth-25470DiVA: diva2:358718
Note
QC 20101025Available from: 2010-10-25 Created: 2010-10-25 Last updated: 2017-12-12Bibliographically approved

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Gudmundson, Peter

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