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Electrically active defects in silicon produced by ion channeling
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
University of Aarhus.
University of Aarhus.
2003 (English)In: Applied Physics Letters, ISSN 0003-6951, E-ISSN 1077-3118, Vol. 82, no 22, p. 3865-3867Article in journal (Refereed) Published
Abstract [en]

Low-dose implantations with 65 Si and 150 keV Ge ions into the n(+) top layer of Si n(+)p diodes have been carried out. The defects produced in deeper-lying layers were studied by deep level transient spectroscopy. Results were compared to crystal-TRIM calculations and results from 2 MeV electron irradiations. Previously, ion channeling was disregarded in studies on point defect migration at room temperature using ion implantation in surface layers. In our studies, ion channeling is dominant and it overwhelms any contribution from point defect diffusion.

Place, publisher, year, edition, pages
2003. Vol. 82, no 22, p. 3865-3867
Keyword [en]
room-temperature, point-defects, migration, si, traps
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-25714DOI: 10.1063/1.1580640ISI: 000183124200019OAI: oai:DiVA.org:kth-25714DiVA, id: diva2:359548
Note
QC 20101028Available from: 2010-10-28 Created: 2010-10-28 Last updated: 2017-12-12Bibliographically approved
In thesis
1. Capacitance transient measurements on point defects in silicon and silicol carbide
Open this publication in new window or tab >>Capacitance transient measurements on point defects in silicon and silicol carbide
2005 (English)Doctoral thesis, comprehensive summary (Other scientific)
Abstract [en]

Electrically active point defects in semiconductor materials are important because they strongly affect material properties like effective doping concentration and charge carrier lifetimes. This thesis presents results on point defects introduced by ion implantation in silicon and silicon carbide. The defects have mainly been studied by deep level transient spectroscopy (DLTS) which is a quantitative, electrical characterization method highly suitable for point defect studies. The method is based on measurements of capacitance transients and both standard DLTS and new applications of the technique have been used.

In silicon, a fundamental understanding of diffusion phenomena, like room-temperature migration of point defects and transient enhanced diffusion (TED), is still incomplete. This thesis presents new results which brings this understanding a step closer. In the implantation-based experimental method used to measure point defect migration at room temperature, it has been difficult to separate the effects of defect migration and ion channeling. For various reasons, the effect of channeling has so far been disregarded in this type of experiments. Here, a very simple method to assess the amount of channeling is presented, and it is shown that channeling dominates in our experiments. It is therefore recommended that this simple test for channeling is included in all such experiments. This thesis also contains a detailed experimental study on the defect distributions of vacancy and interstitial related damage in ion implanted silicon. Experiments show that interstitial related damage is positioned deeper (0.4 um or more) than vacancy related damage. A physical model to explain this is presented. This study is important to the future modeling of transient enhanced diffusion.

Furthermore, the point defect evolution in low-fluence implanted 4H-SiC is investigated, and a large number of new defect levels has been observed. Many of these levels change or anneal out at temperatures below 300 C, which is not in accordance with the general belief that point defect diffusion in SiC requires high temperatures. This thesis also includes an extensive study on a metastable defect which we have observed for the first time and labeled the M-center. The defect is characterized with respect to DLTS signatures, reconfiguration barriers, kinetics and temperature interval for annealing, carrier capture cross sections, and charge state identification. A detailed configuration diagram for the M-center is presented.

Place, publisher, year, edition, pages
Stockholm: KTH, 2005. p. viii, 89
Series
Trita-FTE, ISSN 0284-0545 ; 2005:2
Keyword
Electronics, Elektronik
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-211 (URN)91-7178-038-6 (ISBN)
Public defence
2005-05-29, Sal C1, KTH-Electrum, 10:15
Opponent
Supervisors
Note
QC 20101028Available from: 2005-05-20 Created: 2005-05-20 Last updated: 2010-10-28Bibliographically approved

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