Dielectric and Plasmon Slot Waveguides for Photonic Integration
2009 (English)In: ICTON 2009: 11th International Conference on Transparent Optical Networks: 2009 11TH INTERNATIONAL CONFERENCE ON TRANSPARENT OPTICAL NETWORKS, VOLS 1 AND 2, NEW YORK: IEEE , 2009, 653-656 p.Conference paper (Refereed)
Slot waveguides formed either in high-index dielectrics or in metals attract great interest because they provide sub-wavelength confinement in the slot region. While this feature is very attractive for devices relying on stimulated emission or nonlinear effects, it does not necessarily improve the integration density. The spacing between dielectric slot waveguides is still limited by diffraction. Although for metal (plasmon) waveguides the total field can be shrunk far beyond the diffraction limit, the associated increase in propagation loss will set practical limits on both the minimum waveguide width and edge-to-edge separation. Here we compare the packing densities for 3D slot waveguides in silicon and plasmon waveguides in gold with a silicon slot. As a reference we also consider silicon photonic wire. We calculate center-to-center waveguide separations (pitch) versus cross-talk level. We show that at ca 24 dB/mu m cross-talk and requiring the attenuation length of at least 5 mu m, plasmon slot waveguides can be packed ca 3.5 times denser than silicon slot waveguides, and ca 2.5 times denser than photonic wires. We also show examples of the fabricated devices.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2009. 653-656 p.
silicon wires, silicon slot waveguides, plasmon slot waveguides, directional coupler, photonic integration density
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-30205DOI: 10.1109/ICTON.2009.5185093ISI: 000274048000168ScopusID: 2-s2.0-70449427378OAI: oai:DiVA.org:kth-30205DiVA: diva2:399502
11th International Conference on Transparent Optical Networks S Miguel, PORTUGAL, JUN 28-JUL 02, 2009
QC 201102222011-02-222011-02-212011-02-22Bibliographically approved