COOLING OF CPU WITH A THERMOSYPHON
2008 (English)In: 2008 SECOND INTERNATIONAL CONFERENCE ON THERMAL ISSUES IN EMERGING TECHNOLOGIES - THEORY AND APPLICATION (THETA), NEW YORK: IEEE , 2008, 239-243 p.Conference paper (Refereed)
In this study the tested evaporator is made from small blocks of copper with I I vertical channels with a diameter of 2.5 mm and length of 30 mm. The riser and downcomer connected the evaporator to the condenser, which is cooled by air in free or forced convection. The condenser is made from 10 mm aluminium heat sink profile of the size of 365x365 mm with a fin length of 20 mm at a distance of 8 mm. In the top part of the heat sink a condenser channel system with 2x2 mm cross section is milled. The CPU used in this study is an Intel Pentium 4 with 3.2 GHz. The maximum heat load to the processor is 104W, and the highest temperature allowed on the processor is 65 degrees C Temperatures are measured for idle, 50% and maximum heat load of the processor at the CPU, evaporator wall, condenser wall and in the ambient. Temperature differences in the thermosyphon system, between the CPU and the evaporator wall, the condenser wall and ambient are presented. Isobutane has been used as the working fluid, due to the fact that it has low saturation pressure and that this refrigerant is friendly to the environment.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2008. 239-243 p.
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-30174DOI: 10.1109/THETA.2008.5167184ISI: 000274779900028ScopusID: 2-s2.0-70449560685OAI: oai:DiVA.org:kth-30174DiVA: diva2:401029
2nd International Conference on Thermal Issues in Emerging Technologies Cairo, EGYPT, DEC 17-20, 2008
QC 201103012011-03-012011-02-212011-03-01Bibliographically approved