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COOLING OF CPU WITH A THERMOSYPHON
KTH, School of Industrial Engineering and Management (ITM), Energy Technology, Applied Thermodynamics and Refrigeration.
KTH, School of Industrial Engineering and Management (ITM), Energy Technology.
2008 (English)In: 2008 SECOND INTERNATIONAL CONFERENCE ON THERMAL ISSUES IN EMERGING TECHNOLOGIES - THEORY AND APPLICATION (THETA), NEW YORK: IEEE , 2008, 239-243 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this study the tested evaporator is made from small blocks of copper with I I vertical channels with a diameter of 2.5 mm and length of 30 mm. The riser and downcomer connected the evaporator to the condenser, which is cooled by air in free or forced convection. The condenser is made from 10 mm aluminium heat sink profile of the size of 365x365 mm with a fin length of 20 mm at a distance of 8 mm. In the top part of the heat sink a condenser channel system with 2x2 mm cross section is milled. The CPU used in this study is an Intel Pentium 4 with 3.2 GHz. The maximum heat load to the processor is 104W, and the highest temperature allowed on the processor is 65 degrees C Temperatures are measured for idle, 50% and maximum heat load of the processor at the CPU, evaporator wall, condenser wall and in the ambient. Temperature differences in the thermosyphon system, between the CPU and the evaporator wall, the condenser wall and ambient are presented. Isobutane has been used as the working fluid, due to the fact that it has low saturation pressure and that this refrigerant is friendly to the environment.

Place, publisher, year, edition, pages
NEW YORK: IEEE , 2008. 239-243 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-30174DOI: 10.1109/THETA.2008.5167184ISI: 000274779900028Scopus ID: 2-s2.0-70449560685OAI: oai:DiVA.org:kth-30174DiVA: diva2:401029
Conference
2nd International Conference on Thermal Issues in Emerging Technologies Cairo, EGYPT, DEC 17-20, 2008
Note

QC 20110301

Available from: 2011-03-01 Created: 2011-02-21 Last updated: 2016-12-19Bibliographically approved

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