Scalability of Network-on-Chip Communication Architecture for 3-D Meshes
2009 (English)In: 2009 3RD ACM/IEEE INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP, NEW YORK: IEEE , 2009, 114-123 p.Conference paper (Refereed)
Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for massively integrated electronic systems. The scarcity of vertical interconnects however imposes special constraints on the design of the communication architecture. This article examines the performance and scalability of different communication topologiesfor 3-D Network-on-Chips (NoC) using Through-Silicon-Was (TSV) for inter-die connectivity. Cycle accurate RTL-level simulations are conducted for two communication schemes based on a 7-port switch and a centrally arbitrated vertical bus using different traffic patterns. The scalability of the 3-D NoC is examined under both communication architectures and compared to 2-D NoC structures in terms of throughput and latency in order to quantify the variation of network performance with the number of nodes and derive key design guidelines.
Place, publisher, year, edition, pages
NEW YORK: IEEE , 2009. 114-123 p.
3D networks, Communication architectures, Communication schemes, Communication topologies, Cycle accurate, Design constraints, Design guidelines, Global interconnect delay, Integrated electronics, Network on chip, Technology solutions, Through silicon vias, Traffic pattern, Biological materials, Electric network topology, Interconnection networks, Microprocessor chips, Network performance, Routers, Scalability, Systems engineering, Three dimensional
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-30398DOI: 10.1109/NOCS.2009.5071459ISI: 000271940100020ScopusID: 2-s2.0-70349808489ISBN: 978-1-4244-4142-6OAI: oai:DiVA.org:kth-30398DiVA: diva2:401069
3rd International Symposium on Networks-on-Chip, La Jolla, CA, MAY 10-13, 2009
QC 201103012011-03-012011-02-242015-12-21Bibliographically approved