Change search
ReferencesLink to record
Permanent link

Direct link
Compact Modelling of Through-Silicon Vias (TSVs) in Three-Dimensional (3-D) Integrated Circuits
KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.
Show others and affiliations
2009 (English)In: 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, NEW YORK: IEEE , 2009, 322-329 p.Conference paper (Refereed)
Abstract [en]

Modeling parasitic parameters of Through-Silicon-Via (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circuits and interconnections in three-dimensional (3-D) Integrated Circuits (ICs). This paper presents a complete set of self-consistent equations including self and coupling terms for resistance, capacitance and inductance of various TSV structures. Further, a reduced-order electrical circuit model is proposed for isolated TSVs as well as bundled structures for delay and SI analysis, and extracted TSV parasitics are employed in Spectre simulations for performance evaluations. Critical issues in the performance modeling for design space exploration of 3-D ICs such as crosstalk induced switching pattern dependent delay variation and cross-talk on noise are discussed. The error in these metrics when using the proposed models as compared to a field solver is contained to a few percentage points.

Place, publisher, year, edition, pages
NEW YORK: IEEE , 2009. 322-329 p.
National Category
Computer and Information Science
URN: urn:nbn:se:kth:diva-30157DOI: 10.1109/3DIC.2009.5306541ISI: 000275055600060ScopusID: 2-s2.0-70549084864ISBN: 978-1-4244-4511-0OAI: diva2:401800
IEEE International Conference on 3D Systems Integration San Francisco, CA, SEP 28-30, 2009
QC 20110303Available from: 2011-03-04 Created: 2011-02-21 Last updated: 2012-02-12Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Tenhunen, HannuZheng, Li-Rong
By organisation
Electronic, Computer and Software Systems, ECSVinnExcellence Center for Intelligence in Paper and Packaging, iPACK
Computer and Information Science

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Altmetric score

Total: 11 hits
ReferencesLink to record
Permanent link

Direct link