A framework for the evaluation of resource efficiency in automotive embedded systems
2009 (English)In: DETC2008: PROCEEDINGS OF THE ASME INTERNATIONAL DESIGN ENGINEERING TECHNICAL CONFERENCE AND COMPUTERS AND INFORMATION IN ENGINEERING CONFERENCE , VOL 4, NEW YORK: AMER SOC MECHANICAL ENGINEERS , 2009, 87-96 p.Conference paper (Refereed)
This article discusses the resource utilization of embedded systems in the automotive industry. Traditionally, the major cost driver - or resource input - has been regarded as the hardware cost. Issues Such as software development costs and maintenance costs have historically been neglected. In order to address this, the article embraces the more comprehensive view on resources that a resource can be regarded as anything which could be thought of as a strength or weakness of a given firm. In this article the major drivers of resource consumption are identified. The work has also included several interviews with employees in order to find empirical data of the embedded systems in vehicles. This paper proposes a method to evaluate the resource efficiency of user functions implemented through the embedded system. By the use of Data Envelopment Analysis which has proven to be a useful method - the resource utilization of six user functions is evaluated. Future work of particular interest would be to perform a more extensive case study.
Place, publisher, year, edition, pages
NEW YORK: AMER SOC MECHANICAL ENGINEERS , 2009. 87-96 p.
Automotive embedded systems, Cost drivers, Empirical data, Hardware cost, In-vehicle, Maintenance cost, Resource consumption, Resource efficiencies, Resource utilizations, Software development costs, Automotive industry, Costs, Maintenance
Production Engineering, Human Work Science and Ergonomics
IdentifiersURN: urn:nbn:se:kth:diva-30720DOI: 10.1115/DETC2008-49905ISI: 000268879900010ScopusID: 2-s2.0-69949187130ISBN: 978-0-7918-4328-4OAI: oai:DiVA.org:kth-30720DiVA: diva2:402695
ASME International Design Engineering Technical Conferences/Computers and Information in Engineering Conference, New York, NY, AUG 03-06, 2008
QC 201103092011-03-092011-03-042011-03-09Bibliographically approved